If there’s one thing that will bring down the yield of your PCB assembly, it’s your solder paste. Put too much on, and you’ll get bridged leads. If you don’t put enough on, that pad might not make good contact. [ScalarElectric] has an amazing trick that’s sure to astonish and astound. Just use wedges and you’ll get better yield with fine-pitched components.
The trick here is to define the cream/solder paste layer of each package as a wedge on each pad instead of the usual rectangle. This gives a few benefits, the largest being the increased gap between paste shapes. You’re also getting a reduction in the total amount of paste applied, and a subsequent improvement in yield. (Reportedly, we’d love to see some data on this.)